SMT product solutions
- Product Details
| Maximum signal processing rate: 28Gbps differential signal | Board-level EMC design |
| Maximum design layers: 28 layers | CE, FCC safety certification |
| Minimum BGA design pitch: 0.4mm | RF design and analysis |
| Minimum design line width/line spacing: 2.5/2.5mil | HDI design: buried blind hole, hole in the disk, buried capacitance, buried resistance |
| Minimum drilling: 3mil | |
| Maximum Number of Connections: 30000 | DFX design: DFM, DFA, DFT, DFC |
| Maximum number of pins: 40000 | FPC design: 20-layer rigid-flex board |
| The maximum number of BGAs for designing PCB boards: 44 | Maximum number of BGA pins: 2397 |
| Involving CPU: Samsung's high-end ARM chips (such as S5PC100, S3C6410, S3C4420, etc.) Intel’s CPU series (such as Bay Trail, Haswll, etc.) FPGA: Xilinx's Virtex-7, etc., Altera's Stratix-V, etc. Switch chip: Broadcom's BCM56846, BCM88650, etc., Marvell's 88E6083, etc. Memory: Mircon's DDR3 (MT41 series), Samsung's DDR3 (K4B2G0846), etc., Cypress's CY7C1510, CY7C1565, etc. |
|
Prev：None
Next：None
